Yuksel Temiz

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MAIN PUBLICATIONS

EPFL NEWS

* Giving research a boost with cheaper biochips, 14.03.2012, http://actu.epfl.ch/news/giving-research-a-boost-with-cheaper-biochips/

* Jumpstarting computers with 3D chips, 25.01.2012, http://actu.epfl.ch/news/jumpstarting-computers-with-3d-chips/

JOURNAL PAPERS

* Design and Testing Strategies for Modular 3D-Multiprocessor Systems Using Die-level Through Silicon Via Technology, G. Beanato, P. Giovannini, A. Cevrero, P. Athanasopoulos, M. Zervas, Y. Temiz, and Y. Leblebici, IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 2012 (accepted).

* 3D Integration Technology for Lab-on-a-Chip Applications, Y. Temiz, S. Kilchenmann, Y. Leblebici and C. Guiducci, Electronics Letters, Jan. 2012.

* Resistive Programmable Through Silicon Vias for Reconfigurable 3D Fabrics, D. Sacchetto, M. Zervas, Y. Temiz, G. De Micheli, and Y. Leblebici, IEEE Transactions on Nanotechnology, 99, 2012.

* A Compact Angular Rate Sensor System Using A Fully-Decoupled Silicon-On-Glass MEMS Gyroscope, S.E.Alper, Y.Temiz, T.Akin, IEEE/ASME Journal of MicroElectroMechanical Systems, Vol 17, pp. 1418-1429, Dec 2008.

CONFERENCE PAPERS

* A CMOS Compatible Chip-to-Chip 3D Integration Platform, Y. Temiz, M. Zervas, C. Guiducci, and Y. Leblebici, Electronic Components and Technology Conference, 2012 (Accepted).

* Wafer Level Deep TSV Fabrication and Electrical Analysis, M. Zervas, Y. Temiz, and Y. Leblebici, Electronic Components and Technology Conference, 2012 (Accepted).

* Microchannel-Based Liquid Interlayer Cooling in High-Performance 3D Stacks, Y. Temiz and Y. Leblebici, 16th IEEE European Test Symposium - Workshop on Low Power Design Impact on Test and Reliability, Trondheim, Norway, May 23-27, 2011.

* Die-Level TSV Fabrication Platform for CMOS-MEMS Integration, Y. Temiz, M. Zervas, C. Guiducci, and Y. Leblebici, Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2011), Beijing, China, 2011.

* Towards Thermally-Aware Design of 3D MPSoCs with Inter-Tier Cooling, M. Sabry, A. Sridhar, D. Atienza Alonso, Y. Temiz, Y. Leblebici, S. Szczukiewicz, N. Borhani, J. R. Thome, T. Brunschwiler, and B. Michel, Proceedings of Design, Automation and Test in Europe (DATE '11), Grenoble, France, 2011.

* Robust Microelectrodes Developed for Improved Stability in Electrochemical Characterization of Biomolecular Layers, Y. Temiz, A. Ferretti, E. Accastelli, Y. Leblebici, and C. Guiducci, Proceedings of the 9th Annual IEEE Conference on Sensors (Sensors'10), Hawaii, USA, 2010.

* Integrating Bio-sensing Functions on CMOS Chips, C. Guiducci, Y. Temiz, Y. Leblebici, E. Accastelli, A. Ferretti, G. Cappi, and E. Bianchi, Proceedings of Asia Pacific Conference on Circuits and Systems (APCCAS 2010), 2010.

* Validation of the Porous-Medium Approach to Model Interlayer-Cooled 3D-Chip Stacks, T. Brunschwiler, S. Paredes, U. Drechsler, and B. Michel (IBM), W. Cesar, G. Töral, Y. Temiz, and Y. Leblebici (EPFL), IEEE International Conference on 3D System Integration (3DIC), San Francisco, USA, September 2009.

* 3D Architecture and Replaceable Layers for Label-Free DNA Biochips, Y. Temiz, S. Carrara, A. Cavallini, and Y. Leblebici, 3rd Int. Workshop on Advances in Sensors and Interfaces (IWASI09), Trani, Italy, June 2009

* Real-Time High-Sensitivity Impedance Measurement Interface for Tethered BLM Biosensor Arrays, Y. Temiz, F. Gurkaynak, S. Terrettaz, H. Vogel, G. De Micheli, Y. Leblebici, C. Guiducci, and L. Benini, The 7th Annual IEEE Conference on Sensors (SENSORS08), Lecce, Italy, October 2008.

* A Novel In-Operation High g-Survavible MEMS Gyroscope, K. Azgin, Y. Temiz, T. Akin, The 6th Annual IEEE Conference on Sensors (SENSORS07), Atlanta, Georgia, USA, October 28-31, 2007.

* An SOI-MEMS Tuning Fork Gyroscope with Linearly Coupled Drive Mechanism, K. Azgin, Y. Temiz, T. Akin, The 20th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2007), pp. 607-610, Kobe, Japan, January 21-25, 2007.